Influence of Thermal Conductivity and Fracture Toughness on the Thermal Shock Resistance of Alumina—Silicon–Carbide–Whisker Composites

Abstract

The thermal shock resistance (indentation–quench method), fracture toughness, and thermal conductivity of three alumina–silicon–carbide–whisker composites and alumina have been investigated. A new procedure for the evaluation of thermal conductivity data is suggested, and higher room‐temperature thermal conductivity than that reported in the literature is determined for silicon carbide whiskers. The ranking of the materials according to thermal shock resistance is consistent with the ranking according to fracture toughness but disagrees with the ranking according to thermal conductivity. This finding supports the analytically obtained result that, in defining thermal shock resistance, fracture toughness is more important than thermal conductivity.