Concepedia

Application of push-off shear test for evaluation of wetting-interface structure-bonding relationship of solder joints

N. Sobczak, J. Sobczak, R. Nowak, Artur Kudyba, P. Darłak, B. Mikułowski, Andrzej Wojciechowski

Journal of Materials Science · 2005 · 13 citations · 3 references

DOI

Concepts

References

3

Database for Solder Properties with Emphasis on New Lead-free Solders

David R. Smith, Thomas A. Siewert, L Stephen et al. · 2002 · 178 citations

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The effect of temperature, matrix alloying and substrate coatings on wettability and shear strength of Al/Al2O3 couples

N. Sobczak, M. Książek, Rajiv Asthana et al. · Metallurgical and Materials Transactions A · 2004 · 31 citations

, , +17

Physical metallurgy in lead-free electronic solder development

K. N. Subramanian, Jin Gyun Lee · JOM · 2003 · 18 citations

, , +14