Publication | Closed Access
Kinetics of Intermetallic Compound Formation at the Interface Between Sn-3.0Ag-0.5Cu Solder and Cu-Zn Alloy Substrates
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Citations
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References
2010
Year
Materials ScienceMaterials EngineeringEngineeringCorrosionIntermetallic Compound FormationSurface ScienceApplied PhysicsMetallurgical InteractionMetallurgical ProcessAlloy PhaseCu-zn Alloy SubstratesMicrostructureMetal Processing
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