A Low-Temperature Bonding Process Using Mixed Cu–Ag Nanoparticles - Concepedia

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A Low-Temperature Bonding Process Using Mixed Cu–Ag Nanoparticles

141

Citations

16

References

2010

Year

Yoshiaki Morisada, T. Nagaoka, Masao Fukusumi, Yukiyasu Kashiwagi, Mari Yamamoto, Masami Nakamoto

Journal of Electronic Materials

Materials ScienceEngineeringMetal NanoparticlesNanomaterialsNanotechnologyChemistry

References

	Year	Citations

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