Concepedia

Cracking and phase stability in reaction layers between Sn-Cu-Ni solders and Cu substrates

Kazuhiro Nogita, C.M. Gourlay, T. Nishimura

JOM · 2009 · 155 citations · 20 references

DOI

Concepts

References

20

A Rietveld-Analysis Programm RIETAN-98 and its Applications to Zeolites

Fujio Izumi, Takuji Ikeda · Materials science forum · 2000 · 1.8K citations · Full text

, , +5

Interfacial reactions between lead-free solders and common base materials

Tomi Laurila, Vesa Vuorinen, J.K. Kivilahti · Materials Science and Engineering R Reports · 2005 · 1.1K citations

, , +12

The superstructure of domain-twinned η'-Cu<sub>6</sub>Sn<sub>5</sub>

Lars Stenberg, Sven Lidin · Acta Crystallographica Section B Structural Science · 1994 · 274 citations

, , +16

A new investigation of the system Ni–Sn

Clemens Schmetterer, Hans Flandorfer, Klaus W. Richter et al. · Intermetallics · 2006 · 240 citations

, , +1

Nickel-stabilized hexagonal (Cu, Ni)6Sn5 in Sn–Cu–Ni lead-free solder alloys

Kazuhiro Nogita, Tetsuro Nishimura · Scripta Materialia · 2008 · 202 citations

, , +10