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Cracking and phase stability in reaction layers between Sn-Cu-Ni solders and Cu substrates

Materials ScienceMaterials EngineeringSn-cu-ni SoldersEngineeringCorrosionReaction LayersPhase StabilitySurface ScienceApplied PhysicsMechanical EngineeringMetallurgical InteractionElectronic PackagingAlloy PhaseMicrostructureMetal Processing