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A quantitative surface analytical study of electrochemically‐formed copper oxides by XPS and X‐ray‐induced Auger spectroscopy
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Citations
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References
1988
Year
Materials ScienceChemical EngineeringCopper Oxide MaterialsEngineeringMm Auger SignalCorrosionSurface ElectrochemistrySurface ScienceElectrochemical InterfaceElectrode Reaction MechanismX‐ray‐induced Auger SpectroscopyChemistryElectrochemical ProcessCu 2Copper OxidesElectrochemistryClean CuElectrochemical Surface Science
Abstract Electrochemically partially‐oxidized Cu specimens are transferred from the electrolyte (pH 13 and 14) within a closed system without air contact to the UHV and examined with XPS especially by interpreting the x‐ray‐induced Auger signal L 3 MM. The signal was fitted with standard spectra of clean Cu and Cu 2 O using an approximation by the Gauss/Lorentz curves. The oxide thickness calculated from the intensity ratio of the Cu 2 O and Cu signal with an appropriate value for the escape depth of the electrons agrees well with the evaluation of the electrochemical data. Angular dependent measurements permit a reliable examination of Cu 2 O of less than 0.5 monolayers. The water content of the oxide layer deduced from a quantitative evaluation of the O 1s XPS signal decreases with increasing thickness of Cu 2 O approaching less than 10% for ca . 10 monolayers. The small amount of hydroxide is located at the outmost layer. The growth of an outer CuO film leads to an increase of the hydroxide content to ca . 30%. These studies show that the Cu L 3 MM Auger signal may be used to evaluate quantitatively the amount of Cu 2 O.
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