Publication | Closed Access
Thermal management of electronic devices using carbon foam and PCM/nano-composite
158
Citations
12
References
2014
Year
Materials ScienceEngineeringMechanical EngineeringThermal ManagementThermal PropertyThermal AnalysisThermodynamicsHeat TransferElectronic PackagingThermal EngineeringThermal ConductivityCarbon Foam
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