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High critical current density NbN/AlN/NbN tunnel junctions fabricated on ambient temperature MgO substrates
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Citations
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References
1994
Year
Materials EngineeringMaterials ScienceElectrical EngineeringAluminium NitrideEngineeringWide-bandgap SemiconductorTunneling MicroscopyCritical Current DensityNanoelectronicsOxide ElectronicsSemiconductor DeviceSuperconductivityApplied PhysicsNbn/aln/nbn Tunnel JunctionsMicroelectronicsIntentional Heating
NbN/AlN/NbN tunnel junctions are fabricated at ambient temperature on MgO substrates, and a critical current density of 8 kA/cm2 is obtained in junctions with 1.5–nm–thick AlN barriers. Even though the NbN/AlN/NbN trilayers are deposited without intentional heating, the junctions show a large gap voltage (Vg=5 mV), sharp quasiparticle current rise (ΔVg=0.16 mV), and small subgap leakage current (Vm=25 mV and Rsg/RN=9). This report shows that high-quality NbN/AlN/NbN tunnel junctions can be made at ambient substrate temperature.
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