Publication | Closed Access
Effects of temperature and strain rate on the mechanical properties of lead-free solders
15
Citations
9
References
2010
Year
Materials ScienceEngineeringMechanical PropertiesMechanical EngineeringCold WorkingHot WorkingSolid MechanicsHeat TreatingElectronic PackagingThermomechanical AnalysisLead-free SoldersStrain RateThermomechanical ProcessingMechanics Of MaterialsMicrostructure
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