Publication | Closed Access

Copper diffusion into silicon substrates through TaN and Ta/TaN multilayer barriers

Materials ScienceMaterials EngineeringCopper DiffusionEngineeringDiffusion ResistanceSurface ScienceApplied PhysicsSilicon SubstratesSemiconductor MaterialSemiconductor Device FabricationElectronic PackagingSilicon On InsulatorTa/tan Multilayer Barriers