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Enhancement of sp3 hybridized C in amorphous carbon films by Ar ion bombardment and Si incorporation
25
Citations
22
References
2003
Year
Materials ScienceMaterials EngineeringElectronic DevicesEngineeringElectronic MaterialsSi IncorporationApplied PhysicsSp3 Hybridization FractionSemiconductor Device FabricationIntegrated CircuitsChemical Vapor DepositionThin FilmsAmorphous Carbon FilmsThin Film Process TechnologyAmorphous SolidAr Ion BombardmentSilicon On InsulatorThin Film Processing
We report an effective method of increasing the sp3 hybridization fraction in sputtered amorphous carbon (a-C) film by the combination of Ar ion bombardment and Si incorporation. In the deposition of an a-C film, Ar ion bombardment by controlling the applied bias voltage plays a role in creating high stress in film and causes the local bonding configuration to change to a sp3 hybridized bond. Simultaneously, the incorporated Si in an a-C network breaks the sp2 hybridized bonded ring and promotes the formation of a sp3 hybridized bond. This enhancement of the sp3 hybridized bonding characteristic is maximized for an a-C film with 23 at. % of Si and 100–150 V of applied bias voltage. In this region, the increase of resistivity, optical band gap, and mechanical hardness of a-C is attributed to the reduction of the sp2 hybridized bonded ring and increased fraction of the sp3 hybridized bond. However, at a higher bias voltage above 150 V, the enhancement effect is reduced due to the resputtering and thermally activated reconversion of a sp3 to a sp2 hybridized bond.
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