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Size effects on yield strength and strain hardening for ultra-thin Cu films with and without passivation: A study by synchrotron and bulge test techniques

Materials EngineeringMaterials ScienceYield StrengthEngineeringSevere Plastic DeformationApplied PhysicsSize EffectsYield (Engineering)Strain HardeningElectronic PackagingThin FilmsWork HardeningMechanics Of MaterialsMicrostructureThin Film Processing