Reliability-configurable mixed-grained reconfigurable array supporting C-to-array mapping and its radiation testing

Abstract

This paper presents a mixed-grained reconfigurable VLSI array architecture that can cover mission-critical applications to consumer products through C-to-array application mapping. A proof-of-concept VLSI chip was fabricated in 65nm process. Measurement results show that applications on the chip can be working in a harsh radiation environment. Irradiation tests also show the correlation between the number of sensitive bits and the mean time to failure. Furthermore, the temporal error rate of an example application due to soft errors in the datapath were measured and demonstrated for reliability-aware mapping.