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Effect of ultrasonication medium on the properties of copper nanoparticle-filled epoxy composite for electrical conductive adhesive (ECA) application

Materials ScienceElectroactive MaterialElectrical EngineeringUltrasonication MediumEngineeringPower UltrasoundNanomaterialsSonoelectrochemistryElectrical Conductive AdhesiveComposite TechnologyUltrasoundNanocompositeElectrical Insulation