Microstructure of Electrodeposited Cu‐Ni Binary Alloy Films

Abstract

The codeposition of Cu and Ni in the electrodeposition method without a complexing agent is difficult, since the standard electrode potentials of Cu and Ni differ by approximately 600 mV. In this study the electrodeposited Cu‐Ni alloy films with various compositions were obtained using glycine as the complexing agent. Consequently, composition of the deposited Cu‐Ni alloy films can be controlled by bath composition and pH, and the crystallographic structure of all the deposited Cu‐Ni alloy films consists of a single solid solution and is not influenced by pH.