Publication | Closed Access
Fatigue crack growth behavior of 96.5Sn–3.5Ag lead-free solder
60
Citations
16
References
2001
Year
Materials ScienceEngineeringMechanical EngineeringLead-free SolderSolid MechanicsElectronic PackagingCrack FormationDynamic Crack PropagationLow-cycle FatigueMechanics Of Materials
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