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High-quality YBa2Cu3O7−<i>x</i> thin films by plasma-enhanced metalorganic chemical vapor deposition at low temperature
38
Citations
16
References
1991
Year
EngineeringAbrupt Film-substrate InterfacesElectron DiffractionThin Film Process TechnologyChemical DepositionLow TemperatureSuperconductivityHigh Tc SuperconductorsMolecular Beam EpitaxyEpitaxial GrowthThin Film ProcessingMaterials ScienceHigh-tc SuperconductivityCritical Current DensityOxide ElectronicsApplied PhysicsCondensed Matter PhysicsThin FilmsChemical Vapor Deposition
Single-crystalline epitaxial YBa2Cu3O7-x thin films with a sharp superconducting transition temperature of 90 K and a critical current density of 3.3×106 A/cm2 at 77 K were prepared by a plasma-enhanced metalorganic chemical vapor deposition (PE-MOCVD) process. The films were formed in situ on (100) LaAlO3 substrates at a temperature of 670 °C in 2 Torr partial pressure of N2O. X-ray analysis indicated that films grew epitaxially with the c-axis perpendicular to the substrate and the a and b axes uniformly aligned along the LaAlO3 [100] directions. High-resolution transmission electron microscopy along with electron diffraction revealed that the films grew epitaxially with atomically abrupt film-substrate interfaces. The high degree of epitaxial crystallinity of the films was also confirmed by Rutherford backscattering spectroscopy which gave a minimum channeling yield of 9%.
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