Development of strain reduced GaN on Si (111) by substrate engineering

Abstract

We report on a novel scheme of substrate engineering to obtain high-quality GaN layers on Si substrates. Ion implantation of an AlN∕Si substrate is performed to create a defective layer that partially isolates the III-nitride layer and the Si substrate and helps to reduce the strain in the film. Raman spectroscopy shows a substantial decrease in in-plane strain in GaN films grown on nitrogen implanted substrates. This is confirmed by the enhancement of the E2 (TO) phonon frequency from 564 to 567cm−1 corresponding to 84% stress reduction and substantial decrease in crack density for a 2-μm-thick GaN film. GaN films grown on implanted AlN∕Si substrate have better optical properties and smoother surface morphology as compared to nonimplanted AlN∕Si substrate.