Superconformal filling of 41nm trenches with Cu electroless deposition on Au-activated self-assembled monolayer - Concepedia

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Superconformal filling of 41nm trenches with Cu electroless deposition on Au-activated self-assembled monolayer

14

Citations

20

References

2010

Year

Wei Han, Gil Ho Hwang, Sukjoon Hong, H.H. An, Chong Seung Yoon, JIN-BAE KIM, M.J. Lee, Gang Hong, K.S. Park, S.G. Kang

Materials Chemistry and Physics

Materials EngineeringMaterials ScienceCu Electroless DepositionEngineeringSuperconformal FillingSurface ScienceApplied PhysicsAu-activated Self-assembled MonolayerSurface NanotechnologyChemical DepositionSurface Nanoengineering

References

	Year	Citations

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