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Diamond disc pad conditioning in chemical mechanical planarization (CMP): A surface element method to predict pad surface shape

Materials ScienceMaterials EngineeringEngineeringMaterial ProcessingMechanical EngineeringPad Surface ShapeMaterial ModelingSolid MechanicsSurface Element MethodComputer-aided DesignPlasticitySurface ProcessingChemical Mechanical PlanarizationMechanics Of MaterialsMicrostructure