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A study on the orientation relationship between the scallop-type Cu6Sn5 grains and (011) Cu substrate using electron backscattered diffraction
25
Citations
12
References
2009
Year
EngineeringElectron DiffractionChemistryOrientation RelationshipMolten SnSolidificationScallop-type Cu6sn5 GrainsMaterials ScienceMaterials EngineeringPhysicsCu Single CrystalMetallurgical InteractionCrystallographyCu Single CrystalsMicrostructureCu SubstrateHigh Temperature MaterialsNatural SciencesSurface ScienceApplied PhysicsAlloy Phase
The wetting reaction between molten Sn and (011) Cu single crystal was investigated. Based on the electron backscattered diffraction technique, the preferential orientation relationships between the scallop-type Cu6Sn5 grains and (011) Cu single crystals were detected. The strong texture of Cu6Sn5 grains was formed on the normal direction although the Sn/(011) Cu couple was aged at 170 °C for 40 days. This indicates that the Cu6Sn5 grains do not desultorily form on the (011) Cu substrate for these scallop-type Cu6Sn5 grains.
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