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Effect of Thermal Aging on Drop Performance of Chip Scale Packages with SnAgCu Solder Joints on Cu Pads

Materials ScienceChip-scale PackageEngineeringDrop PerformanceAdvanced Packaging (Semiconductors)Hardware ReliabilityChip On BoardMechanical EngineeringChip AttachmentHeat TransferElectronic PackagingMicroelectronicsThermal EngineeringThermal AgingChip Scale PackagesMicrostructure