Effect of grain size and temperature on the yield stress of the intermetallic compound TiAl - Concepedia

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Effect of grain size and temperature on the yield stress of the intermetallic compound TiAl

99

Citations

9

References

1989

Year

Vijay K. Vasudevan, S.A. Court, Peter Kurath, Hamish L. Fraser

Scripta Metallurgica

Materials ScienceMaterials EngineeringEngineeringMechanical EngineeringIntermetallic Compound TialYield StressMaterial PerformanceYield (Engineering)PlasticityGrain SizeMechanics Of MaterialsMicrostructure

References

	Year	Citations

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