Publication | Open Access
Loss characteristics of silicon substrate with different resistivities
48
Citations
10
References
2006
Year
Electrical EngineeringFinite ConductivityEngineeringRf SemiconductorSpecific ResistanceHigh-frequency DeviceNanoelectronicsMicrowave TransmissionApplied PhysicsLoss CharacteristicsSemiconductor Device FabricationIntegrated CircuitsElectronic PackagingSilicon On InsulatorMicroelectronicsMicrowave EngineeringHigh Frequency IcDielectric Relaxation
Abstract In the design of high‐speed and high frequency IC's, the influence of the substrate on the circuit performance must be considered carefully. This work investigates the loss characteristic of silicon substrate with different resistivities and distinguishes theoretically and experimentally the dielectric losses into the intrinsic loss of silicon (tan δ D ) and the extrinsic substrate leakage loss (tan δ L ) caused by the finite conductivity of the substrate. The dielectric relaxation (cut off) frequency as a function of silicon substrate resistivity are calculated as considering the conditions of substrate noise isolation and RF passive device design. © 2006 Wiley Periodicals, Inc. Microwave Opt Technol Lett 48: 1773–1776, 2006; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.21786
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