On the strain rate sensitivity of the flow stress of ultrafine-grained Cu processed by equal channel angular extrusion (ECAE)

Three strategies to achieve uniform tensile deformation in a nanostructured metal

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Microstructures and properties of copper processed by equal channel angular extrusion for 1–16 passes

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Grain size dependence of the plastic deformation kinetics in Cu

H. Conrad · Materials Science and Engineering A · 2002 · 322 citations

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Deformation behavior of thin copper films on deformable substrates

M. Hommel, O. Kraft · Acta Materialia · 2001 · 227 citations

Natural Sciences, Materials Engineering, Materials Science +16

Transition from strengthening to softening by grain boundaries in ultrafine-grained Cu

Yujiao Li, Xiaolu Zeng, W. Blum · Acta Materialia · 2004 · 185 citations

Natural Sciences, Materials Engineering, Materials Science +14