Publication | Open Access
Laser Damage Gettering and Its Application to Lifetime Improvement in Silicon
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1981
Year
Point DefectsEngineeringMechanical EngineeringLaser ApplicationsLattice DefectsLaser OpticsPulsed Laser DepositionLaser Damage GetteringMaterials EngineeringMaterials ScienceCrystalline DefectsLaser Processing TechnologyDefect FormationLaser-assisted DepositionMicrostructureAdvanced Laser ProcessingDislocation InteractionLaser-induced BreakdownApplied PhysicsLifetime ImprovementLaser-surface InteractionsOptoelectronicsLaser Damage
Lattice defects induced by laser irradiation and their thermal stability during subsequent oxidation were studied by transmission electron microscopy, x‐ray topography, and preferential etching. High power laser pulses above 20 J/cm2 produced dislocation lines and dislocation clusters. Laser pulses of about 15 J/cm2 also generated dislocation clusters and pseudo‐swirl defects in the irradiated region. All of these defects were thermally stable. However, thermally stable defects were not observed when laser pulses of less than 15 J/cm2 were used, although unstable dislocations were generated. The suppression of defect formation by laser damage gettering was examined using Sirtl etching. It was found that thermally stable dislocations and pseudo‐swirl defects acted as sinks for point defects and prevented the formation of precipitates during a subsequent oxidation. Laser damage gettering was used to improve generation lifetime in metal‐oxide‐semiconductor (MOS) capacitors with the result that generation lifetime in the gettered area was improved by two orders of magnitude over that in the ungettered area.