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Effect of Wet Pretreatment on Interfacial Adhesion Energy of Cu-Cu Thermocompression Bond for 3D IC Packages

Materials EngineeringMaterials ScienceEngineeringAdvanced Packaging (Semiconductors)Ic PackagesAdhesive MaterialSurface ScienceMechanical EngineeringChip AttachmentInterfacial Adhesion EnergyElectronic PackagingThermal EngineeringWet PretreatmentInterface PropertyStructural Adhesive