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Residual stress and structural characteristics in Ti and Cu sputtered films on glass substrates at different substrate temperatures and film thickness

Materials ScienceMaterials EngineeringStructural CharacteristicsEngineeringFilm ThicknessSurface ScienceApplied PhysicsResidual StressAmorphous MetalThin FilmsElectronic PackagingChemical DepositionChemical Vapor DepositionThin Film ProcessingMicrostructure