Publication | Closed Access
Effects of Co additions on electromigration behaviors in Sn–3.0 Ag–0.5 Cu-based solder joint
46
Citations
17
References
2011
Year
Materials ScienceMaterials EngineeringElectrical EngineeringCo AdditionsEngineeringElectromigration TechniqueApplied PhysicsElectronic PackagingElectromigration BehaviorsElectrochemistryElectrochemical Surface Science
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