Effects of Co additions on electromigration behaviors in Sn–3.0 Ag–0.5 Cu-based solder joint

Recent advances on electromigration in very-large-scale-integration of interconnects

K. N. Tu · Journal of Applied Physics · 2003 · 1.1K citations

Engineering, Electrical Engineering, Materials Science +17

Current-crowding-induced electromigration failure in flip chip solder joints

Everett C. C. Yeh, Woon‐Seop Choi, K. N. Tu et al. · Applied Physics Letters · 2002 · 363 citations

Engineering, Electrical Engineering, Materials Science +17

Reduction of Electromigration in Aluminum Films by Copper Doping

I. Ames, F. M. d’Heurle, R. E. Horstmann · IBM Journal of Research and Development · 1970 · 301 citations

Natural Sciences, Materials Engineering, Materials Science +17

Polarity effect of electromigration on kinetics of intermetallic compound formation in Pb-free solder V-groove samples

H. Gan, K. N. Tu · Journal of Applied Physics · 2005 · 267 citations · Full text

Engineering, Materials Engineering, Materials Science +17

Wetting reaction versus solid state aging of eutectic SnPb on Cu

K. N. Tu, T. Y. Lee, J. W. Jang et al. · Journal of Applied Physics · 2001 · 117 citations

Natural Sciences, Materials Engineering, Materials Science +17