IEEE Microwave and Wireless Components Letters · 2015 · 16 citations · 3 references
EngineeringElectrical EngineeringMicroelectronicsMicrowave EngineeringWireless CommunicationsHigh-frequency Semiconductor DevicesImpedance MatchingMicrowave Integrated CircuitsMillimeter-wave CommunicationsMixed-signal Integrated Circuit DesignRadio-frequency Integrated CircuitsBicmos TechnologyDuplex CommunicationMatchingMicrowave DuplexersMillimeter-wave Integrated CircuitsSatcom IntegrationSige Bicmos DesignTransmission Losses
This letter reports the design and measurements of a SiGe BiCMOS duplexer developed for T/R (transmit/receive) Ka-band SatCom on-the-move user terminals. The IC presented in this work is designed for the integration in a hexa-core chip for dual-band phased array applications. Due to the particular configuration of the chip, the duplexer has four ports: one common port, one input port for the R channel and two output ports for the T channels. The chip size is 570 × 400 μm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> including the measurements pads. Simulated and measured results demonstrate that the proposed device achieves good performance in both frequency bands in terms of input matching, transmission losses and isolation.
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Annular ring slot radiating element for integrated millimeter wave arrays
Giandomenico Amendola, Emilio Arnieri, Luigi Boccia et al. · 2012 · 19 citations