Poly(benzimidazole‐imide‐amide)s containing hexafluoroisopropylidene units

Abstract

Abstract New poly(benzimidazole‐imide‐amide)s containing hexafluoroisopropylidene units in the backbone have been synthesized by polycondensation of diaminobenzimidazoles with novel diacid dichlorides which incorporated both imide and hexafluoroisopropylidene groups. These polymers have high thermal stability and low dielectric constant and are soluble in polar aprotic solvents giving transparent, flexible films by casting their solutions. Such properties make them attractive for applications as dielectric coatings in microelectronics.