Inter-chip optical interconnects using imaging fiber bundles and integrated CMOS detectors

Abstract

We present a novel parallel optical link for inter-chip communication. The link consists of a high-performance LED array flip-chip mounted on CMOS drivers, an imaging fiber bundle and a standard CMOS detector/receiver array. The power consumption is 4 mW and 7.5 mW per channel at 300 Mbit/s and 700 Mbit/s, respectively. Each channel takes an area of merely 100 /spl mu/m /spl times/ 100 /spl mu/m.