An analysis of precision, Fly-Through Solder Jet printing for DCA components

Abstract

An analytical model of Fly-Through Solder Jet printing has been used to develop expected operating parameters and geometric configurations for solder jet printing at size scales typical of Direct Chip Attach devices. The modelling incorporates as a reference condition (reality check) the successful Fly-Through printing that has been reported for Chip Scale Package devices by Pham-Van-Diep et. al.. Factors considered in the model are; targeting error, droplet in-flight cooling, electrostatic in-flight interactions, droplet aerodynamic drag, maintaining constant volume depositions by preventing impact splashing, and precision directional control of the droplet stream as the scale changes. The important factors become system constraints and are modelled as functions of system geometry and operating parameters. System configurations and operating parameters are found as a function of target size, with all of the important constraints satisfied.