3D CMOS SOI for high performance computing

Abstract

This paper addresses three topics : first, a new three-dimensional CMOS-SOI technology is presented, then design methodologies are proposed for this technology and last, a comparison is carried out between 2D and 3D designs. In this technology the P-channel devices are stacked over the N-channel ones. All gates are 100 nm length. New design constraints are introduced. Consequently, new design methodologies have to be developed in order to fully take advantage of the outstanding features of 3D integration, like for example the reduced length of interconnections. A 16/spl times/16 bit multiplier was designed in this technology. Comparative results between 2D and 3D integration are given here in terms of energy consumption, delay and area.