Journal of The Electrochemical Society · 1985 · 25 citations · 0 references
Natural SciencesMaterials EngineeringMaterials SciencePolymer MaterialsSurface EngineeringSurface ScienceAdhesive BondingPolymer AdhesionSurface ModificationThin Film AdhesionAdhesion Failure AnalysisAdhesion PromotersAdhesion PropertiesAdhesion StrengthAdhesion To SubstrateAdhesive Failure AnalysisBond StrengthCohesive Failure
The effects of surface treatments and cure temperature on polyimide to silicon nitride adhesion strength are discussed. Results show the importance of surface cleanliness and the requirement for an adhesion promoter. X‐ray photoelectron spectroscopy (XPS) was used to study the mode of failure at different cure temperatures. As the cure temperature is increased, the mode of failure goes from primarily cohesive to a mixed adhesive/cohesive failure, as inferred from the XPS data.