Polyimide Adhesion: Mechanical and Surface Analytical Characterization

Abstract

The effects of surface treatments and cure temperature on polyimide to silicon nitride adhesion strength are discussed. Results show the importance of surface cleanliness and the requirement for an adhesion promoter. X‐ray photoelectron spectroscopy (XPS) was used to study the mode of failure at different cure temperatures. As the cure temperature is increased, the mode of failure goes from primarily cohesive to a mixed adhesive/cohesive failure, as inferred from the XPS data.