The multilayer ceramic integrated circuit (MCIC) technology : Opportunities and challenges

Abstract

Hundreds of discrete components are used in the design and assembly of wireless radio products and the numbers are increasing to meet the market need for increased functionality. Manufacturing and cost issues are driving the need to develop technologies which can effectively integrate these components achieving functions that meet performance requirements in a cost effective way. In this regard, the use of low temperature cofiled ceramic technology to make multilayer ceramic integrated circuits (MCIC)for high frequency wireless communication equipment has gained momentum in recent years. The advantages related to using MCIC for integration of passive components, especially at 800 MHz and above, are discussed relative to other technologies. The Q of transmission lines at these frequencies are sensitive to the dielectric and metal losses of the materials used. They are also sensitive to the volume of the structures and design issues relating size to Q performance are reviewed. The frequency drift associated with the device is also important, placing unique requirements on the ceramic dielectric used in the MCIC. This paper discusses the challenges and opportunities for new materials and processing techniques that could reduce cost and enhance the performance of MCIC for high frequency applications.