Publication | Closed Access
Automated visual inspection of surface mount PCBs
30
Citations
3
References
2002
Year
Unknown Venue
EngineeringSurface IntegrityComputer-aided DesignIntegrated CircuitsWindow RegionsDefect ToleranceHardware SystemsVisual InspectionElectronic PackagingComputational GeometryGeometric ModelingWrong OrientationSurface MountMachine VisionHardware ReliabilityChip On BoardComputer EngineeringComputer ScienceMicroelectronicsAutomated InspectionNatural SciencesSurface Modeling3D Scanning
Techniques used to inspect for defects on surface mount printed circuit boards (PCBs) are presented. Emphasis is placed on five different types of defects, namely missing components, misalignment, wrong orientation of IC chips, wrong parts, and poor solder joints. Five separate algorithms have been developed to detect these faults. The technique of windowing was used to reduce the amount of redundant data to be processed. Preprocessing functions such as convolution, as well as all image processing tasks, are performed on the window regions only, saving on computation time. Experimental results show that these algorithms are reliable, fast, and cost-effective.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">></ETX>
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