Publication | Open Access

Thermogravimetric study of the decomposition of printed circuit boards from mobile phones

Electrical EngineeringEngineeringDerivative ThermogravimetryThermogravimetric StudyPrinted Circuit BoardsThermal AnalysisThermodynamicsThermal ModelingElectronic PackagingTechnologyHeat TransferThermal EngineeringMobile PhonesThermoanalytical Method