350mW G-band medium power amplifier fabricated through a new method of 3D-copper additive manufacturing

Abstract

A new design methodology and 3D additive fabrication process is used to demonstrate a 16-Way medium power amplifier (MPA) at G-band frequency range. Advanced high bandwidth, high gain and power InP DHBT three stage MMIC is used for the MPA integration, capable of 50mW output power and >20 dB small signal gain. Novel micro-machined WR4 to CPW transitions are used to accommodate the MMICs and connect to the 16way splitter-combiner network. These transitions use wire-bonds demonstrating the capability at sub-mmw frequency range. The broadband transitions showcase <;0.5 dB insertion loss and exhibit high tolerance and repeatability due to their batch additive manufacturing. The MPA was assembled using 16 mounted MMICs in transitions and demonstrated >10 dB small signal gain from 200-240 GHz. Large signal characterization showcased high saturated output power of 450mW at 205 GHz, 400 mW at 215 GHz, 350mW at 225 GHz and 283 mW at 233 GHz in an ultra-compact volume of 3.6 cm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sup> representing a functional power density of >7.7 mW/cm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sup> .