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Effect of Ag3Sn: Effective suppression of thermomigration-induced Cu dissolution in micro-scale Pb-free interconnects

Materials EngineeringMaterials ScienceElectromigration TechniqueEffective SuppressionEngineeringNanotechnologySurface ScienceApplied PhysicsMetallurgical InteractionMicro-scale Pb-free InterconnectsThermomigration-induced Cu DissolutionInterconnect (Integrated Circuits)ChemistryElectronic PackagingInterface PropertyMicrostructure