Concepedia

Brazing copper and alumina metallized with Ti-containing Sn0.3Ag0.7Cu metal powder

Wei Fu, Xiaoguo Song, Shengpeng Hu, J.H. Chai, J.C. Feng, G.D. Wang

Materials & Design · 2015 · 45 citations · 24 references

DOI

Concepts

References

24

Interfacial reactions between lead-free solders and common base materials

Tomi Laurila, Vesa Vuorinen, J.K. Kivilahti · Materials Science and Engineering R Reports · 2005 · 1.1K citations

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The relation between wetting and interfacial chemistry in the CuAgTi/alumina system

R. Voytovych, F. Robaut, N. Eustathopoulos · Acta Materialia · 2006 · 168 citations

, , +14

Contribution to the study of reactive wetting in the CuTi/Al2O3 system

P. Kritsalis, L. Coudurier, N. Eustathopoulos · Journal of Materials Science · 1991 · 132 citations

, , +14

Brazing copper to alumina using reactive CuAgTi alloys

O.V. Kozlova, Muriel Braccini, R. Voytovych et al. · Acta Materialia · 2009 · 127 citations

, , +9

Study of copper-alumina bonding

C. Béraud, Michel Courbière, C. Esnouf et al. · Journal of Materials Science · 1989 · 120 citations

, , +12