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Investigation of the thermal decomposition of printed circuit boards (PCBs) via thermogravimetric analysis (TGA) and analytical pyrolysis (Py–GC/MS)

Electrical EngineeringThermogravimetric AnalysisEngineeringDerivative ThermogravimetryThermal ManagementThermal DecompositionPrinted Circuit BoardsThermal AnalysisThermal ModelingThermodynamicsHeat TransferElectronic PackagingThermal EngineeringThermoanalytical Method