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Effects of bonding temperature on microstructure, fracture behavior and joint strength of Ag nanoporous bonding for high temperature die attach

Materials ScienceMaterials EngineeringEngineeringAdhesive MaterialMechanical EngineeringApplied PhysicsChip AttachmentHigh-performance MaterialFracture BehaviorElectronic PackagingHigh TemperatureStructural AdhesiveAg Nanoporous BondingMicrostructureInterface Property