Sintering Methods for Metal Nanoparticle Inks on Flexible Substrates

Abstract

In this paper a number of selective sintering methods suitable for inkjet printed nanoparticles are demonstrated on two different coated papers. The selective methods demonstrated here are electric current heating, microwave sintering and photonic curing. As a reference, conventional heat chamber sintering is also included. Conductivity measurements and studies of sintered structures with optical and scanning electron microscopy are performed, as well as a qualitative evaluation of how the heat-sensitive substrates are affected. The purpose is to analyze characteristics of each method and gain insight in how different process parameters affect overall performance and reliability. With heat chamber sintering the best achievable conductivity without substrate deformation corresponded to less than 20% of pure silver. With some selective methods, conductivity reached well above 50% of pure silver.