Nitto Boseki (Japan)

Institution (Company)

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Also Known As

Nitto Boseki (Japan), Nittobo, 日東紡績株式会社

254

Publications

Citations

Authors

123

Concepts

About

Nitto Boseki (Japan) is a company institution in Tokyo, Japan known for engineering, materials science, and polymer science.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	24	53	3K
2	Medicine	5	16	368
3	Natural Sciences	3	6	218
4	Business	2	4	1.1K
5	Health Sciences	2	2	74

Nitto Boseki (Japan)

254

Publications

Citations

Page 1

	Year	Citations
Mobile application development Andre Charland, Brian Leroux Communications of the ACM EngineeringMobile InteractionSoftware EngineeringNative User ExperienceNative Apps	2011	426
New Agents for <i>t</i>-Butyloxycarbonylation and <i>p</i>-Methoxybenzyloxycarbonylation of Amino Acids Takeshi Nagasawa, Katsumasa Kuroiwa, Kouichi Narita, Bulletin of the Chemical Society of Japan EngineeringAmino AcidsBiochemistryT-butyloxycarbonyl Amino AcidsOrganic Chemistry	1973	125
Mobile Application Development: Web vs. Native Andre Charland, Brian Leroux Queue EngineeringMobile InteractionMobile Operating SystemBetter WordDecent Mobile	2011	112
A method of two-scale analysis with micro-macro decoupling scheme: application to hyperelastic composite materials Kenjiro Terada, Junji Kato, Norio HIRAYAMA, Computational Mechanics Materials ScienceEngineeringMicromechanicsMechanicsMechanical Engineering	2013	96
Homopolymerization of monoallylammonium salts with azo‐initiators Susumu Harada, Sakuro Hasegawa Die Makromolekulare Chemie Rapid Communications EngineeringPolymer ScienceChemistryMonoallylammonium SaltsPolymer Reaction	1984	68
High-Speed Through Silicon Via(TSV) Filling Using Diallylamine Additive Tarō Hayashi, Kazuo Kondo, Takeyasu Saito, Journal of The Electrochemical Society EngineeringHigh-speed Copper ElectrodepositionHigh ThroughputDiallylamine AdditiveSilicon On Insulator	2011	65
High Speed Through Silicon Via Filling by Copper Electrodeposition Kazuo Kondo, Yushi Suzuki, Takeyasu Saito, Electrochemical and Solid-State Letters EngineeringHigh ThroughputSilicon On InsulatorInterconnect (Integrated Circuits)Chemical Engineering	2010	58
Cyclopolymerization of diallylamine derivatives in dimethyl sulfoxide Youji Negi, Susumu Harada, Osamu Ishizuka Journal of Polymer Science Part A-1 Polymer Chemistry EngineeringOrganic ChemistryDiallylamine DerivativesChemistryPolymers	1967	57
The cyclo‐copolymerization of diallyl compounds and sulfur dioxide. II. Diallyldimethylammonium chloride and sulfur dioxide Susuma Harada, Kunio Arai Die Makromolekulare Chemie Chemical EngineeringEngineeringPolymer TechnologyPolymer SciencePolymer Engineering	1967	55
Vector intensity reconstructions in a volume surrounding a rigid spherical microphone array Earl G. Williams, Kazuhiro Takashima The Journal of the Acoustical Society of America	2010	48

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