Ang-Ying Lin

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Active since

2018

Affiliations

Industrial Technology Research Institute(Current)

Brewer Science (United States)

Micron Corporation (United States)

Ang-Ying Lin is an author at Industrial Technology Research Institute specializing in integrated circuit design, fan-out wafer-level packaging, and heterogeneous integration.

Publications per year

2018–2019

Publications

An RDL-First Fan-Out Panel-Level Package for Heterogeneous Integration Applications

Yu-Min Lin, Sheng-Tsai Wu, Chunmin Wang et al. · 2019 · 22 citations

Engineering, Electrical Engineering, Materials Engineering +15

An RDL-First Fan-out Wafer Level Package for Heterogeneous Integration Applications

Yu-Min Lin, Sheng-Tsai Wu, Wen-Wei Shen et al. · 2018 · 19 citations

Engineering, Design, Computer-integrated Manufacturing +15

Optimization of Laser Release Process for Throughput Enhancement of Fan-Out Wafer-Level Packaging

Chia‐Hsin Lee, Jay Su, Xiao Liu et al. · 2018 · 16 citations

Engineering, Manufacturing Engineering, Heat Transfer +16

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