Statistics
Publications
1
Citations
53
H-Index
1
Active since
2018
Affiliations
Samsung (South Korea)(Current)
Jae-Ean Lee is an author at Samsung (South Korea) specializing in materials engineering, three-dimensional integration, and wafer-level packaging.
Publications per year
2018–2018
1
1
Fan-Out Panel Level Package with Fine Pitch Pattern
Jin‐Young Kim, Ikjun Choi, Park Junhyeong et al. · 2018 · 53 citations
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