Statistics
Publications
1
Citations
16
H-Index
1
Active since
2010
Affiliations
Yao-Jung Lee is an author at Industrial Technology Research Institute specializing in adhesive bonding, bonding temperature effects, and anodic bonding.
Publications per year
2010–2010
1
1
Wafer level glass frit bonding for MEMS hermetic packaging
Jin-Sheng Chang, Jing‐Yuan Lin, Shu‐Ching Ho et al. · 2010 · 16 citations
1–1 of 1