Assembling molecular Sierpiński triangle fractals

Jian Shang, Yongfeng Wang, Min Chen, +7

Nature Chemistry

Pattern FormationEngineeringSelf-assemblyMolecular BiologyMedicine +3

Thiol‐Branched Solid Polymer Electrolyte Featuring High Strength, Toughness, and Lithium Ionic Conductivity for Lithium‐Metal Batteries

Hangchao Wang, Qian Wang, Xin Cao, +6

Advanced Materials

Ultra high-strength Mg–Gd–Y–Zn–Zr alloy sheets processed by large-strain hot rolling and ageing

Chao Xu, M.Y. Zheng, Shiwei Xu, +5

Materials Science and Engineering A

Materials ScienceEngineeringMechanical EngineeringMagnesium-based CompositeAlloy Design +4

Unraveling Charge State of Supported Au Single-Atoms during CO Oxidation

Xiong Zhou, Qian Shen, Kaidi Yuan, +9

Journal of the American Chemical Society

Enhanced brain distribution and pharmacodynamics of rivastigmine by liposomes following intranasal administration

Zhenzhen Yang, Yanqing Zhang, Zhanzhang Wang, +3

International Journal of Pharmaceutics

Intranasal AdministrationMedicineNeuropharmacologyEnhanced Brain DistributionNeuroscience +1

A Unified Model:  Self-Assembly of Trimesic Acid on Gold

Yingchun Ye, Wei Sun, Yongfeng Wang, +5

The Journal of Physical Chemistry C

Dendrite‐Free Lithium Deposition via a Superfilling Mechanism for High‐Performance Li‐Metal Batteries

Qian Wang, Chengkai Yang, Jijin Yang, +7

Advanced Materials

I₂- or NBS-Catalyzed Highly Efficient α-Hydroxylation of Ketones with Dimethyl Sulfoxide

Yu‐Feng Liang, Kai Wu, Song Song, +3

Organic Letters

Challenging Secondary CspChemical EngineeringDimethyl SulfoxideDirect PreparationEngineering +13

Immobility of protons in ice from 30 to 190 K

James P. Cowin, Athanasios A. Tsekouras, Martin J. Iedema, +2

Nature

Ice-water SystemHigh-energy Nuclear ReactionNuclear PhysicsPhysicsAtmospheric Icing +3

Warpage and Thermal Characterization of Fan-Out Wafer-Level Packaging

John H. Lau, Ming Li, Dewen Tian, +19

IEEE Transactions on Components Packaging and Manufacturing Technology

Electrical EngineeringChip-scale PackageEngineeringAdvanced Packaging (Semiconductors)Wafer Scale Processing +13