Ultra-low-energy programmable non-volatile silicon photonics based on phase-change materials with graphene heaters

Zhuoran Fang, Rui Chen, Jiajiu Zheng, +10

Nature Nanotechnology

Materials SciencePhotonicsEngineeringGraphene HeatersPhotonic Materials +9

High-specific-power flexible transition metal dichalcogenide solar cells

Koosha Nassiri Nazif, Alwin Daus, Jiho Hong, +13

Nature Communications

Probing Local Strain at MX₂–Metal Boundaries with Surface Plasmon-Enhanced Raman Scattering

Yinghui Sun, Kai Liu, Xiaoping Hong, +6

Nano Letters

Functionalized Carbon Nanotubes for Detecting Viral Proteins

Yian-Biao Zhang, Mandakini Kanungo, Alexander Ho, +8

Nano Letters

Adenovirus Serotype 12NanosensorsEngineeringCarbon NanotechnologyCarbon-based Material +16

Correlation of properties with preferred orientation in coagulated and stretch-aligned single-wall carbon nanotubes

Stéphane Badaire, Vincent Pichot, Cécile Zakri, +6

Journal of Applied Physics

EngineeringPreferred OrientationCarbon NanotechnologyMechanical EngineeringNanostructured Polymer +17

High Thermal Conductivity of Submicrometer Aluminum Nitride Thin Films Sputter-Deposited at Low Temperature

Christopher Perez, Aaron J. McLeod, Michelle Chen, +12

ACS Nano

Electro-Thermal Confinement Enables Improved Superlattice Phase Change Memory

Asir Intisar Khan, Heungdong Kwon, Michelle Chen, +4

IEEE Electron Device Letters

Resistance DriftElectrical EngineeringElectronic DevicesEngineeringPhysics +9

Self‐Passivation of Defects: Effects of High‐Energy Particle Irradiation on the Elastic Modulus of Multilayer Graphene

Kai Liu, Cheng‐Lun Hsin, Deyi Fu, +12

Advanced Materials

Materials ScienceElastic ModulusGraphene NanomeshesGraphene-based Nano-antennasEngineering +12

Two-Fold Reduction of Switching Current Density in Phase Change Memory Using Bi₂Te₃ Thermoelectric Interfacial Layer

Asir Intisar Khan, Heungdong Kwon, Raisul Islam, +6

IEEE Electron Device Letters

Two-fold ReductionEngineeringEnergy EfficiencyCurrent DensityEmerging Memory Technology +18

Cooling future system-on-chips with diamond inter-tiers

Mohamadali Malakoutian, Anna Kasperovich, D. Rich, +16

Cell Reports Physical Science

EngineeringHeat SpreadingComputer ArchitectureDiamond Inter-tiersThermal Conductivity +20